TBOMK, certain tests (jitter) require one to place o-scope (or other test instrument's) probes on IC pins (or ckt traces). Can someone explain how one can do this and not affect the performance of the device. E.g., digital electronics require shielding, so taking the cover off and probing/testing effectively removes some of the shiled.
Also, how do you (Stereophile) probe today's ultra-small ICs (SOP, MSOP size, etc.). "Very carefully" or "We contract out to mosquitos" do not qualify as answers 
Ref:
http://en.wikipedia.org/wiki/List_of_electronics_package_dimensions
TBOMK, certain tests (jitter) require one to place o-scope (or other test instrument's) probes on IC pins (or ckt traces). Can someone explain how one can do this and not affect the performance of the device. E.g., digital electronics require shielding, so taking the cover off and probing/testing effectively removes some of the shiled.
Also, how do you (Stereophile) probe today's ultra-small ICs (SOP, MSOP size, etc.). "Very carefully" or "We contract out to mosquitos" do not qualify as answers
Ref:
http://en.wikipedia.org/wiki/List_of_electronics_package_dimensions